Yes, Hard- and Software are able to process structures higher than 300µm. This is done via stitching in z-direction. However, you need an objective with an appropriate working distance (>300µm). These are in general air objectives with a lower NA and thus a lower resolution. You may for example use a 63x 0.75NA air objective with a working distance of about 1.9mm. Technically you are able to write structures as high as 1.9mm. Another issue however is the aberrations when going deeper into the photo-resist going along with the loss of laser power and resolution. This is why we cannot guarantee the maximum writing depth or height. We are currently doing some testing of high structures.
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